I-vacuum metallization - "inqubo entsha futhi enobungani bemvelo yokuhlanganisa indawo"

Izimonyo zokupakisha i-vacuum metallization

Vacuum metallization

I-vacuum metallization, eyaziwa nangokuthi i-physical vapor deposition (PVD), iyinqubo yokuhlanganisa eyinkimbinkimbi edlulisela izakhiwo zensimbi kuma-substrates angewona ezensimbi ngokufaka amafilimu amancane ensimbi. Le nqubo ihilela ukuhwamuka komthombo wensimbi ngaphakathi kwegumbi levacuum, insimbi ehwamukile ijiya endaweni engaphansi ukuze yakhe ukunamathela kwensimbi okuncane, okufanayo.

Inqubo ye-vacuum metallization

1.Ukulungiselela:I-substrate ihlanzwa ngokucophelela kanye nokulungiswa kwendawo ukuze kuqinisekiswe ukunamathela okuhle nokufana kokunamathela.

2.Igumbi le-vacuum:I-substrate ifakwe ekamelweni le-vacuum futhi inqubo ye-metallization yenziwa ngaphansi kwezimo ezilawulwa ngokuqinile. Ikamelo liyakhishwa ukuze kwakhiwe indawo yokungena ephezulu, kuqedwe umoya nokungcola.

3.Ukuhwamuka kwensimbi:Imithombo yensimbi iyashiswa ekamelweni le-vacuum, ibangele ukuthi ihwamuke noma i-sublimate ibe ama-athomu ensimbi noma ama-molecule, njll.

4.Ideposition:Lapho umhwamuko wensimbi uthinta i-substrate, uyajiya futhi wenze ifilimu yensimbi. Inqubo yokubeka iyaqhubeka kuze kube yilapho ukushuba nokumbozwa okufunayo kufinyelelwa, okuholela ekugqokeni okufanayo okunezici ezinhle kakhulu ze-optical kanye nemishini.

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Sihlinzeka ngezinto ezisebenzisekayo ze-vacuum metallization, njenge-tungsten evaporation filament (ikhoyili ye-tungsten), isikebhe esihwamukayo, izintambo ze-aluminium ezihlanzekile, njll.


Isikhathi sokuthumela: Apr-25-2024